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AMIS-30663 High Speed CAN Transceiver
Introduction
The AMIS-30663 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12 V and 24 V systems. The digital interface level is powered from a 3.3 V supply providing true I/O voltage levels for 3.3 V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-30663 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals.
Key Features
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PIN ASSIGNMENT
TxD GND VCC RxD (Top View) 1 AMIS 30663 V33 CANH CANL VREF
* * * * * * * * * * * * * *
Fully Compatible with the "ISO 11898-2" Standard Certified "Authentication on CAN Transceiver Conformance (d1.1)" High Speed (up to 1 Mbit/s) Ideally Suited for 12 V and 24 V Industrial and Automotive Applications Low EME Common-mode-choke is No Longer Required Differential Receiver with Wide Common-mode Range (35 V) for High EMS No Disturbance of the Bus Lines with an Un-powered Node Transmit Data (TxD) Dominant Time-out Function Thermal Protection Bus Pins Protected Against Transients in an Automotive Environment Short Circuit Proof to Supply Voltage and Ground Logic Level Inputs Compatible with 3.3 V Devices ESD Protection Level for CAN Bus up to 8 kV This is a Pb-Free Device
Table 1. Ordering Information
Container Part Number AMIS30663CANG2G AMIS30663CANG2RG Description HS CAN Transc. (3.3 V) HS CAN Transc. (3.3 V) Package SOIC-8 GREEN SOIC-8 GREEN Shipping Configuration Tube/Tray Tape & Reel Quantity 96 3000 Temp. Range -40C to 125C -40C to 125C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
January, 2009 - Rev. 6
1
Publication Order Number: AMIS-30663/D
AMIS-30663
Table of Contents Page Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Technical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin List and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Measurement Set-ups and Definitions . . . . . . . . . . . . . . . 8 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
VCC 3 V33 Thermal shutdown 7 TxD 1 'S' V33 8 AMIS-30663 RxD 4 COMP VCC 5 2 GND Ri(cm) VCC/2 + Ri(cm) Timer Driver control 6 CANH CANL
VREF
Figure 1. Block Diagram
Table 2. Technical Characteristics
Symbol VCANH VCANL Vo(dif)(bus_dom) tpd(rec-dom) tpd(dom-rec) CM-range Parameter DC voltage at pin CANH DC voltage at pin CANL Differential bus output voltage in dominant state Propagation delay TxD to RxD Propagation delay TxD to RxD Input common-mode range for comparator Common-mode peak Common-mode step Conditions 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit 42.5 W < RLT < 60 W Figure 7 Figure 7 Guaranteed differential receiver threshold and leakage current Figures 8 and 9 (Note 1) Figures 8 and 9 (Note 1) Min -45 -45 1.5 100 100 -35 -500 -150 Max +45 +45 3 230 245 +35 500 150 Unit V V V ns ns V mV mV
VCM-peak VCM-step
1. The parameters VCM-peak and VCM-step guarantee low EME.
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AMIS-30663
Typical Application
VBAT
IN
5V-reg
OUT
60 W
60 W 47 nF
IN
3.3V- reg
OUT VCC RxD CAN controller 8 4 V33 3 7 VCC CANH
CAN BUS
AMIS- VREF 30663 5 TxD 1 2 6 GND CANL 60 W 60 W 47 nF
GND
Figure 2. Application Diagram
TxD GND VCC RxD
1 2 3 4 (top view)
8 7 6 5
V33 CANH CANL VREF
Figure 3. Pin Configuration
AMIS- 30663
Table 3. Pin Out
Pin 1 2 3 4 5 6 7 8 Name TxD GND VCC RxD VREF CANL CANH V33 Description Transmit data input; low input dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter low output Reference voltage output LOW-level CAN bus line (low in dominant mode) HIGH-level CAN bus line (high in dominant mode) 3.3 V supply for digital I/O
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AMIS-30663
Functional Description
General Operating Modes
The AMIS-30663 is the interface between the CAN protocol controller and the physical bus. It is intended for use in automotive and industrial applications requiring baud rates up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898-2" standard.
Table 4. Function Table (X = don't care)
Pin Mode TxD RxD State
AMIS-30663 only operates in high-speed mode as illustrated in Table 4. The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME.
Bus CANH CANL
4.75 V < Vcc < 5.25 V High Speed Vcc < PORL - X 1 Recessive 0 < VCANH < VCC 0 < VCANH < VCC 0 < VCANL < VCC 0 < VCANL < VCC 0 1 0 1 Dominant Recessive High 0.5 Vcc Low 0.5 Vcc
PORL < Vcc < 4.75 V - > VIH 1 Recessive
Over-temperature Detection
A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes HIGH. The thermal protection circuit is particularly needed when a bus line short circuits.
TxD Dominant Time-out Function
Should TxD become disconnected, this pin is pulled high internally. When the Vcc supply is removed, pins TxD and RxD will be floating. This prevents the AMIS-30663 from being supplied by the CAN controller through the I/O pins.
3.3 V Interface
A TxD dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin TxD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TxD. If the duration of the LOW-level on pin TxD exceeds the internal timer value tdom, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TxD.
Fail-safe Features
AMIS-30663 may be used to interface with 3.3 V or 5 V controllers by use of the V33 pin. This pin may be supplied with 3.3 V or 5 V to have the corresponding digital interface voltage levels. When the V33 pin is supplied at 2.5 V, even interfacing with 2.5 V CAN controllers is possible. See also Digital Output Characteristics @ V33 = 2.5 V, Table 8. In this case a pull resistor from TxD to V33 is necessary. Electrical Characteristics
Definitions
A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage - although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Figure 4).
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin.
Absolute Maximum Ratings
Stresses above those listed in Table 5 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability.
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AMIS-30663
Table 5. Absolute Maximum Ratings
Symbol VCC V33 VCANH VCANL VTxD VRxD VREF Vtran(CANH) Vtran(CANL) Vtran(VREF) Vesd(CANL/CANH) Vesd Latch-up Tstg Tamb Tjunc Parameter Supply voltage I/O interface voltage DC voltage at pin CANH DC voltage at pin CANL DC voltage at pin TxD DC voltage at pin RxD DC voltage at pin VREF Transient voltage at pin CANH Transient voltage at pin CANL Transient voltage at pin VREF Electrostatic discharge voltage at CANH and CANL pin Electrostatic discharge voltage at all other pins Static latch-up at all pins Storage temperature Ambient temperature Maximum junction temperature (Note 2) (Note 2) (Note 2) (Note 3) (Note 6) (Note 4) (Note 6) (Note 5) -55 -40 -40 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit Conditions Min. -0.3 -0.3 -45 -45 -0.3 -0.3 -0.3 -150 -150 -150 -8 -500 -4 -250 Max. +7 +7 +45 +45 VCC + 0.3 VCC + 0.3 VCC + 0.3 +150 +150 +150 +8 +500 +4 +250 100 +155 +125 +150 Unit V V V V V V V V V V kV V kV V mA C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a and 3b (see Figure 4). 3. Standardized human body model system ESD pulses in accordance to IEC 1000.4.2. 4. Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is 4 kV. 5. Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 6. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
Table 6. Thermal Characteristics
Symbol Rth(vj-a) Rth(vj-s) Parameter Thermal resistance from junction to ambient in SO8 package Thermal resistance from junction to substrate of bare die Conditions In free air In free air Value 145 45 Unit K/W K/W
Table 7. DC Characteristics
(VCC = 4.75 to 5.25 V; V33 = 2.9 V to 3.6 V; Tjunc = -40 to +150C; RLT = 60 W unless specified otherwise.) Symbol Supply (pin VCC and pin V33) ICC I33 I33 Supply current I/O interface current I/O interface current (Note 7) Recessive; VTXD = VCC V33 = 3.3 V; CL = 20 pF; recessive V33 = 3.3 V; CL = 20 pF; 1 Mbps Dominant; VTXD = 0 V 45 4 65 8 1 170 mA mA mA Parameter Conditions Min. Typ. Max. Unit
Transmitter Data Input (pin TxD) VIH VIL IIH IIL HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Output recessive Output dominant VTxD = V33 VTxD = 0 V 2.0 -0.3 -1 -50 - - 0 -200 VCC +0.8 +1 -300 V V mA mA
7. Not tested on ATE.
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AMIS-30663
Table 7. DC Characteristics
(VCC = 4.75 to 5.25 V; V33 = 2.9 V to 3.6 V; Tjunc = -40 to +150C; RLT = 60 W unless specified otherwise.) Symbol Parameter Conditions Min. Typ. Max. Unit Transmitter Data Input (pin TxD) Ci VOH VOL Ioh Iol VREF VREF_CM Input capacitance (Note 7) - 5 10 pF
Receiver Data Output (pin RxD) HIGH-level output voltage LOW-level output voltage HIGH-level output current (Note 7) LOW-level output current (Note 7) IRXD = - 10 mA IRXD = 5 mA VRxD = 0.7 x V33 VRxD = 0.45 V -50 mA < IVREF < +50 mA -35 V < VCANH < +35 V; -35 V < VCANL < +35 V VTxD = VCC; no load VTxD = VCC; no load -35 V < VCANH < +35 V; 0 V < VCC < 5.25 V -35 V < VCANL < +35 V; 0 V < VCC < 5.25 V VTxD = 0 V VTxD = 0 V VTxD = 0 V; dominant; 42.5 W < RLT < 60 W VTxD = VCC; recessive; no load Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Short circuit output current at pin CANH Short circuit output current at pin CANL Differential receiver threshold voltage VCANH = 0 V; VTxD = 0 V VCANL = 36 V; VTxD = 0 V -5 V < VCANH < +12 V; see Figure 5 Vihcm(dif) (th) Differential receiver threshold voltage for high common-mode -35 V < VCANH < +35 V; see Figure 5 -35 V < VCANH < +35 V; see Figure 5 -35 V < VCANL < +35 V; 50 70 100 mV -35 V < VCANL < +35 V; 0.25 0.7 1.05 V -5 V < VCANL < +12 V; -10 5 0.7 x V33 0.75 x V33 0.18 -15 10 0.35 -20 15 V V mA mA
Reference Voltage Output (pin VREF) Reference output voltage Reference output voltage for full common-mode range 0.45 x VCC 0.40 x VCC 0.50 x VCC 0.50 x VCC 0.55 x VCC 0.60 x VCC V V
Bus Lines (pins CANH and CANL) Vo(reces)(CANH) Vo(reces)(CANL) Io(reces) (CANH) Io(reces) (CANL) Vo(dom) (CANH) Vo(dom) (CANL) Vo(dif) (bus) Recessive bus voltage at pin CANH Recessive bus voltage at pin CANL Recessive output current at pin CANH Recessive output current at pin CANL Dominant output voltage at pin CANH Dominant output voltage at pin CANL Differential bus output voltage (VCANH - VCANL) 2.0 2.0 -2.5 -2.5 3.0 0. 5 1.5 -120 -45 45 0.5 2.5 2.5 - - 3.6 1.4 2.25 0 -70 70 0.7 3.0 3.0 +2.5 +2.5 4.25 1.75 3.0 +50 -95 120 0.9 V V mA mA V V V mV mA mA V
Vi(dif) (hys)
Differential receiver input voltage hysteresis
Bus Lines (pins CANH and CANL) Ri(cm)(CANH) Ri(cm) (CANL) Ri(cm)(m) Common-mode input resistance at pin CANH Common-mode input resistance at pin CANL Matching between pin CANH and pin CANL common-mode input resistance VCANH = VCANL 15 15 -3 25 25 0 37 37 +3 KW KW %
7. Not tested on ATE.
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AMIS-30663
Table 7. DC Characteristics
(VCC = 4.75 to 5.25 V; V33 = 2.9 V to 3.6 V; Tjunc = -40 to +150C; RLT = 60 W unless specified otherwise.) Symbol Parameter Conditions Min. Typ. Max. Unit Bus Lines (pins CANH and CANL) Ri(dif) Ci(CANH) Ci(CANL) Ci(dif) ILI(CANH) ILI(CANL) Differential input resistance Input capacitance at pin CANH Input capacitance at pin CANL Differential input capacitance Input leakage current at pin CANH Input leakage current at pin CANL Common-mode peak during transition from dom rec or rec dom Difference in common-mode between dominant and recessive state VTxD = VCC; not tested VTxD = VCC; not tested VTxD = VCC; not tested VCC = 0 V; VCANH = 5 V VCC = 0 V; VCANL = 5 V Figures 8 and 9 Figures 8 and 9 10 10 -500 -150 25 50 7.5 7.5 3.75 170 170 75 20 20 10 250 250 500 150 KW pF pF pF mA mA mV mV
VCM-peak VCM-step
Power on Reset PORL
POR level
CANH, CANL, Vref in tri- state below POR level
2.2
3.5
4.7
V
Thermal Shutdown Tj(sd) td(TxD-BUSon) td(TxD-BUSoff) td(BUSon-RxD) td(BUSoff-RxD) tpd(rec-dom) td(dom-rec) tdom(TxD) shutdown junction temperature 150 160 180 C
Timing Characteristics (see Figures 6 and 7) Delay TxD to bus active Delay TxD to bus inactive Delay bus active to RxD Delay bus inactive to RxD Propagation delay TxD to RxD from recessive to dominant Propagation delay TxD to RxD from dominant to recessive TxD dominant time for time out VTxD = 0 V 40 30 25 65 100 100 250 450 85 60 55 100 110 110 110 135 230 245 750 ns ns ns ns ns ns ms
7. Not tested on ATE.
Table 8. Digital Output Characteristics @ V33 = 2.5 V
Symbol Receiver Data Output (pin RxD) Ioh Iol HIGH-level output current LOW-level output current Parameter
(VCC = 4.75 to 5.25 V; V33 = 2.5 V 5%; Tjunc = -40 to +150C; RLT = 60 W unless specified otherwise.) Conditions Min. Typ. Max. Unit
VOH > 0.9 x V33 VOL < 0.1 x V33
-2.6 4
mA mA
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AMIS-30663
Measurement Set-ups and Definitions
+3.3 V +5 V 100 nF VCC 3 TxD 1 V33 8 7 AMIS- 30663 CANH 1 nF 5 VREF 1 nF CANL Transient Generator 100 nF
RxD
4 2
6
20 pF
GND
Figure 4. Test Circuit for Automotive Transients
V RxD High
Low Hysteresis 0,5 0,9 V i(dif)(hys)
Figure 5. Hysteresis of the Receiver
+3.3 V +5 V 100 nF TxD VCC 3 1 V33 8 7
100 nF CANH RLT CLT 100 pF
RxD 20 pF
4
AMIS- V 30663 5 REF 60 W 6 CANL 2 GND
Figure 6. Test Circuit for Timing Characteristics
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AMIS-30663
TxD HIGH LOW
CANH CANL dominant Vi(dif) = VCANH - VCANL RxD t d(TxD-BUSon) t pd(rec-dom) 0,3 x V33 t d(TxD-BUSoff) td(BUSon-RxD) t pd(dom-rec) 0,9V 0,5V recessive
0,7 x V33 td(BUSoff-RxD)
Figure 7. Timing Diagram for AC Characteristics
+3.3 V +5 V V CC 3 TxD 1 AMIS- 30663 6 4 2 20 pF GND V 33 8 7 CANH 6.2 k W 10 nF Active Probe CANL 6.2 k W 5 30 W V REF 47 nF 30 W Spectrum Anayzer 100 nF
Generator RxD
Figure 8. Basic Test Set-up for Electromagnetic Measurement
CANH
CANL
recessive VCM = 0.5*(VCANH+VCANL) V CM-peak V CM-step V CM-peak
Figure 9. Common-mode Voltage Peaks (see measurement set-up Figure 8)
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AMIS-30663
Soldering
Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the ON Semiconductor "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCB) with high population densities. In these situations re-flow soldering is often used.
Re-flow Soldering
* Use a double-wave soldering method comprising a
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250C. The top-surface temperature of the packages should preferably be kept below 230C.
Wave Soldering
turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): 1. Larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; 2. Smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Manual Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
Table 9. Soldering Process
Fix the component by first soldering two diagonally- opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C.
Soldering Method Package BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC (Note 10), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Wave Not suitable Not suitable (Note 9) Suitable Not recommended (Notes 10 and 11) Not recommended (Note 12) Re-flow (Note 8) Suitable Suitable Suitable Suitable Suitable
8. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." 9. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 10. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 11. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 12. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Company or Product Inquiries
For more information about ON Semiconductor's products or services visit our Web site at http://onsemi.com.
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AMIS-30663
PACKAGE DIMENSIONS
SOIC 8 CASE 751AZ-01 ISSUE O
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